KYOWARIKEN Products

We’re proud to be the EXCLUSIVE DISTRIBUTOR for KYOWARIKEN Products in Malaysia and South East Asia.

Kyowa Riken Co.,Ltd (Japan) have been established when the booming of Semiconductor Industry, and they have been manufacturing many kinds of High Precision Semiconductor equipment for R&D based on their excellent technical capabilities since 40 years.
These are the exclusive 9 Products from KYOWARIKEN (Japan), that we’re offering to our customers:-

 

(SPIN COATER)  *Click here for product brochure.

This equipment is a high precision small spin coater to coat photo-resist on the substrate.

(MASK ALIGNER) *Click here for product brochure.

This equipment is a high accuracy manual type UV exposure unit with mercury lamp for the purpose of R&D.

(MICROPROBER) *Click here for product brochure.

This equipment is to measure electrical characteristic for semiconductor wafer, PCB, materials. We provide accessories for manipulator, probe, microscopes, shield cases, etc.

(SCRIBER) *Click here for product brochure.

This equipment is single axis manual system with diamond point Scriber and helps your microfabrication.

(DRILLER) *Click here for product brochure.

This instrument is used steel balls as abrasive jig, and it is simple and easy measuring the thickness of Si epitaxial layer or diffusion layer.

(RESISTIVITY METER) *Click here for product brochure.

This equipment was designed according to DC 4-point probe regulation, and we are also supplying Measuring stages and 4-point probes.

(LIFETIME METER) *Click here for product brochure.

This instrument measures silicon wafer’s lifetime using a resonance circuit principle.
This method enables non-contact, easy measurement of a wafer’s lifetime. This method most efficiently demonstrates its power by selecting an appropriate oscilloscope.

(P.N CHECKER) *Click here for product brochure.

*Click here for product brochure.

(NAIL AND HEAD BONDER) *Click here for product brochure.

This equipment is to connect wire as wire connection device, which is used bonding tool, prescribed position of heated integrated circuit by wire. The wire is used 0.05mm gold wire.

 

Please submit your inquiry and ORDER FORM here.

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